An ultra-thin, four-layer flex PCB with a 12碌m core and a total thickness of just 110碌m achieves an impressive minimal bend radius of 220碌m, 50% smaller compared to conventional designs!
This cutting-edge technology is gaining traction in industries where miniaturisation is key, such as medical applications.
To enhance reliability in bending zones:
- Keep traces in the inner layers to prevent cracks and damage
- Use a special solder mask or, even better, a coverlayer
- Opt for Direct Immersion Gold (DIG) as it offers superior bending performance by eliminating nickel, unlike ENIG and ENEPIG
The future of flex PCBs is thinner, more flexible, and more durable than ever!