We are excited to announce the release of our latest onepager, diving into the innovative world of semi-additive plating (SAP) for printed circuit boards (PCBs).
SAP is revolutionising PCB production, offering even smaller features, enhanced precision, better control over copper thickness, and the ability to manufacture more complex designs while reducing PCB thickness. Our process enables ultra-fine 8/8 碌m line/space structures, setting new standards for precision and density.
Our onepager gives you a quick yet powerful overview of the key advantages and technical specs behind our SAP process.
Whether you’re looking to optimise your production process or explore cutting-edge technologies, the onepager, combined with our feature subsite, is your perfect starting point.
Find more details and download the full onepager on our website.