Interconnect Solutions such as Wrap-Around PCBs for Optimal Thermal Management
By DYCONEX
A concise white paper presenting DYCONEX's wrap-around PCB interconnect solutions鈥攃ombining flexible multilayer circuits, copper-filled microvias, metal back-sheets/cores (CIC, CMC, Al) and advanced materials (LCP, polyimide)鈥攖o separate electrical and mechanical functions and deliver high-density, highly reliable thermal management for aerospace, defense, and RF applications.